G-5022 is a reactive Polyamide Resin which shows excellent adhesion, toughness, water and chemical resistance as a curing agent for epoxy coatings and adhesives. It is particularly designed for use in solventbased surface coatings.

YD-128 is a liquid type standard Epoxy Resin derived from Bisphenol-A. It has excellent adhesion, chemical resistance, heat resistance, etc. Due to its special properties, YD-128 is generally used in many fields. YD-128 is the most standard liquid resin for general use.

KH 30 01 [2,4,6 Tris(Dimethylaminomet hyl )Phenol] is a versatile curing agent for epoxy resins, both in its own right and also as an activator of other curing agent, including carboxylic acid anhydrides, amine adducts and polyamides. It is also the preferred curing agent for blends of liquid epox ide resin and liquid polysulphides.

YDF-170 is a liquid type Epoxy Resin derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-170 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appropriate curing agents . Due to its special properties, YDF-170 is generally used in coatings, moldings, adhesive, construction and civil works, and composite applications for the low VOC or non-solvent system. YDF-170 is a standard BPF type liquid resin.