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S-21

S-21 is a distilled base epoxy resin for use in formulating UV-curable cycloaliphatic epoxide coatings systems. S-21 contributes to primary film properties. S-21 has both carboxylate and epoxy groups, with the potential for fast cure. S-21 is widely used in industry for the preparation of inks, resins, coatings, and encapsulation.

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RBL

N,N-DIMETHYL ACRYLAMIDE

N,N-DIMETHYL ACRYLAMIDE is a monomer with easy to polymerization.

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RBL

N-ACRYLOYL MORPHOLINE

N-ACRYLOYL MORPHOLINE is a monomer with low viscosity and highly curable.

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DENSURF HR 800

DENSURF HR 800 (Binder / Solution of phenylmethyl polysiloxane resin) is an air-drying silicon resin used in heat resistant coatings. It is compatible with organic resins such as alkyd resin. It gives thermal stability up to 650°C when formulated with suitable thermally stable pigments and fillers such as aluminum and iron oxide pigments.

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