S-21 is a distilled base epoxy resin for use in formulating UV-curable cycloaliphatic epoxide coatings systems. S-21 contributes to primary film properties. S-21 has both carboxylate and epoxy groups, with the potential for fast cure. S-21 is widely used in industry for the preparation of inks, resins, coatings, and encapsulation.

S-06E is an electronic grade epoxy. It can be used as a casting resin, in LED encapsulation, insulating materials, 3D printing, carbon fibre cable cores and other composite materials, giving outstanding performance for UV resistance and anti-radiation properties.It is UV curable, Thermal curable with anhydrides, High TG up to 195ºC, Excellent yellowing resistance and good UV resistance, Outstanding electrical insulation, Low halogen and High purity and low viscosity.

DENSURF HR 800 (Binder / Solution of phenylmethyl polysiloxane resin) is an air-drying silicon resin used in heat resistant coatings. It is compatible with organic resins such as alkyd resin. It gives thermal stability up to 650°C when formulated with suitable thermally stable pigments and fillers such as aluminum and iron oxide pigments.

DENSURF HR 900 (Binder / Solution of phenylpolysiloxane) is an air-drying silicon resin used in heat resistant coatings. It is compatible with organic resins such as alkyd resin. It gives thermal stability up to 650°C when formulated with suitable thermally stable pigments and fillers such as aluminum and iron oxide pigments.