S-21 is a distilled base epoxy resin for use in formulating UV-curable cycloaliphatic epoxide coatings systems. S-21 contributes to primary film properties. S-21 has both carboxylate and epoxy groups, with the potential for fast cure. S-21 is widely used in industry for the preparation of inks, resins, coatings, and encapsulation.

S-06E is an electronic grade epoxy. It can be used as a casting resin, in LED encapsulation, insulating materials, 3D printing, carbon fibre cable cores and other composite materials, giving outstanding performance for UV resistance and anti-radiation properties.It is UV curable, Thermal curable with anhydrides, High TG up to 195ºC, Excellent yellowing resistance and good UV resistance, Outstanding electrical insulation, Low halogen and High purity and low viscosity.

EPOXY NPEL 127E is an undiluted resin with a lower viscosity than NPEL-128E but providing similar properties after cure. Cured with polyamine or polyamide, it offers quality and high purity properties in applications, such as maximum mechanical strength, good chemical resistance and excellent heat resistance, etc. Because its low chloride content, NPEL-127E is more suitable for electronic application.

NPEL-128E is a high purity liquid resin, which is manufactured from bisphenol-A and epichlorohydrin. It is recognized as standard form which variations have been developed. Cured NPEL-128E always offers quality and high purity properties in applications, such as maximum mechanical strength, good chemical resistance and excellent heat resistance, etc.