Electronic & Specialties

YDF-170 is a liquid type Epoxy Resin derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-170 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appropriate curing agents . Due to its special properties, YDF-170 is generally used in coatings, moldings, adhesive, construction and civil works, and composite applications for the low VOC or non-solvent system. YDF-170 is a standard BPF type liquid resin.

KH-700 is a waterborne curing agent designed for Hardener of liquid Epoxy Resin. KH-700 is used as a water dispersible curing agent in combination with conventional liquid Epoxy and waterborne Epoxy Resins to form waterborne epoxy paints.

YD-019 is an unmodified Bisphenol-A type solid Epoxy Resin designed for use in high performance, one-package baking finishes. Coatings based on the resin produce films with outstanding flexibility and adhesion as well as exceptional resistance to chemicals and solvents. Typical uses for YD-019 are process equipment coating enamels, collapsible tube coatings, can coating, PCM, metal furniture finishes, and wire enamels.

KH-816 is a cycloaliphatic Amine modified curing agent for use with Epoxy Resins. KH-816 gives high gloss films that are resistant to various chemicals. These properties make it ideal for formulating floorings and tank linings.