VYLOMAX HR-22BL is a polyamideImide with high Tg (280°C). VYLOMAX HR-22BL gives excellent heat and chemical resistance, excellent mechanical properties and very good adhesion on metal. Free of harmful amide solvent (NMP, DMF, DMAc).

KH 30 01 [2,4,6 Tris(Dimethylaminomet hyl )Phenol] is a versatile curing agent for epoxy resins, both in its own right and also as an activator of other curing agent, including carboxylic acid anhydrides, amine adducts and polyamides. It is also the preferred curing agent for blends of liquid epox ide resin and liquid polysulphides.

YDF-170 is a liquid type Epoxy Resin derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-170 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appropriate curing agents . Due to its special properties, YDF-170 is generally used in coatings, moldings, adhesive, construction and civil works, and composite applications for the low VOC or non-solvent system. YDF-170 is a standard BPF type liquid resin.

YD-011 is a Bisphenol-A type unmodified solid Epoxy Resin which can be softened at medium temperature(over 40ºC). Its properties after curing are excellent for mechanical strength, adhesive strength and chemical resistance. YD-011 is recommended for industrial coating primer, top coating and construction & civil work application in solution form with Xylene or other various solvents.