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S-21 is a distilled base epoxy resin for use in formulating UV-curable cycloaliphatic epoxide coatings systems. S-21 contributes to primary film properties. S-21 has both carboxylate and epoxy groups, with the potential for fast cure. S-21 is widely used in industry for the preparation of inks, resins, coatings, and encapsulation.

S-06E is an electronic grade epoxy. It can be used as a casting resin, in LED encapsulation, insulating materials, 3D printing, carbon fibre cable cores and other composite materials, giving outstanding performance for UV resistance and anti-radiation properties.It is UV curable, Thermal curable with anhydrides, High TG up to 195ºC, Excellent yellowing resistance and good UV resistance, Outstanding electrical insulation, Low halogen and High purity and low viscosity.

YDF-170 is a liquid type Epoxy Resin derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-170 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appropriate curing agents . Due to its special properties, YDF-170 is generally used in coatings, moldings, adhesive, construction and civil works, and composite applications for the low VOC or non-solvent system. YDF-170 is a standard BPF type liquid resin.

This is the product for the PIM test and SCI test test test on Discover+