KH-819 is a cycloaliphatic Amine modified curing agent for use with Epoxy Resins. It has very low viscosity in epoxy systems. KH-819 gives very rapid curing rate at ambient and low temperature. It can be used in formulations with good water spot resistance and resistance to amine blush and chemical resistance.

YDPN-638 has advantageous characteristics of good adhesion strength, excellent heat and chemical resistance because of its multi-functional groups in one molecule fully cross-linked. Therefore, it has excellent physical properties in addition to the basic reactivity of general Epoxy Resin.

YD-017 is an unmodified Bisphenol-A type solid Epoxy Resin designed for use in high performance, one-package baking finishes. Coatings based on the resin produce films with outstanding flexibility and adhesion as well as exceptional resistance to chemicals and solvents. Typical uses for YD-017 are process equipment coating enamels, collapsible tube coatings, can coating,

YDF-170 is a liquid type Epoxy Resin derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-170 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appropriate curing agents . Due to its special properties, YDF-170 is generally used in coatings, moldings, adhesive, construction and civil works, and composite applications for the low VOC or non-solvent system. YDF-170 is a standard BPF type liquid resin.