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G-5022 is a reactive Polyamide Resin which shows excellent adhesion, toughness, water and chemical resistance as a curing agent for epoxy coatings and adhesives. It is particularly designed for use in solventbased surface coatings.

YD-017 is an unmodified Bisphenol-A type solid Epoxy Resin designed for use in high performance, one-package baking finishes. Coatings based on the resin produce films with outstanding flexibility and adhesion as well as exceptional resistance to chemicals and solvents. Typical uses for YD-017 are process equipment coating enamels, collapsible tube coatings, can coating,

KH 30 01 [2,4,6 Tris(Dimethylaminomet hyl )Phenol] is a versatile curing agent for epoxy resins, both in its own right and also as an activator of other curing agent, including carboxylic acid anhydrides, amine adducts and polyamides. It is also the preferred curing agent for blends of liquid epox ide resin and liquid polysulphides.

YDF-170 is a liquid type Epoxy Resin derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-170 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appropriate curing agents . Due to its special properties, YDF-170 is generally used in coatings, moldings, adhesive, construction and civil works, and composite applications for the low VOC or non-solvent system. YDF-170 is a standard BPF type liquid resin.